Kev tsim cov cuab yeej pob zeb diamond tuav ntawm ob hom kev sib tham:Kub PressingThiabCOG PRINDINGCov. Cov hau kev no sib txawv fundamentally hauv qhov ntsuas kub, daim ntawv thov siab, tus cwj pwm, thiab cov khoom lag luam khoom zoo. Hauv qab no yog cov ncauj lus kom ntxaws raws li lawv cov yam ntxwv tswv thiab kev lag luam.
1. Cov txheej txheem tsim thiab ntsuas kub
Kub Pressing: Ua nyob rau hauvKev kub siab (1,100-1,400 degree)ThiabKev kub siab (5-10 GPA)15. Thaum tshav kub kub muag cov hlau khi (piv txwv li, Fe-Cu, Fe-ni alloys mus rau encapsulate rau encapsatal hais kom nruj24. Cov txheej txheem no lavics Natural Diamond tsim nyob rau hauv huab Cwj Pwm 5006.
COG PRINDING: Khiav ntawmChav Chav KubNrog cov neeg kho tshuab neeg ib leeg14. Cov khoom siv hmoov (pob zeb diamond graphers thiab hlau khi) yog ua kom muaj zog tsis muaj thermal ua kom muaj zog, ua rau muaj qis dua interparticle koom tes H zog zog Mondlic12.
2. Khoom lag luam
Ceev thiab hardness:
Cov cuab yeej kub tau pomsiab duaVim tias kho cov khoom kom txaus nyob rau hauv tshav kub, txo cov voidsizing thiab ua kom muaj zog faib cov pob zeb diamond uas faib tawm14. Thiaj yias zoo tshaj qhov tawv tawv (piv txwv li, 80-100 GPA) thiab coj kam kam15.
Txias-nias cov cuab yeej feem ntau muajmicrocrracksThiab porosity, txo kev hardness (piv txwv li, 60 -80 GPA) thiab cov cuab yeej ua kom luv luv lithoman14.
Txheej Txheem Kev Ntseeg:
Kev nias kub txo cov kev ntxhov siab sab hauv thiab tiv thaiv kev daws teeb meem, tseem ceeb rau cov ntawv thov hnyav xws li tsuas drilling24.
Kev nias puas txias yuav xav tau cov kev kho mob tom qab los txhim kho cohesion, tab sis seem muaj kev ntxhov siab tsis ntev, cov kabmob muaj peev xwm muaj peev xwm.
3. Ntau Lawm Ua Tau Zoo thiab Nqi
Ceev thiab Padability:
Kev nias kub ua tiav kev ua tiav sai sai (feeb vs. teev rau cov xovxwm txias) tab sis yuav tsum muaj lub zog cua sov system14. Nws foobme-rau-nruab nrabNrog nruj nruj siv26.
Txias Pressing EnablesPawg Ntau Lawm(Piv txwv li, ntau txhiab ntawm cov chav nyob rau ib hnub) nrog kev siv zog tsawg dua, zoo tagnrho rau cov qauv, cov cuab yeej pheej yig )18.
Cov cuab yeej siv thiab cov nqi ua haujlwm:
Cov xovxwm xav tau kev xav tau siab dua thiab kev siv siab thiab cov khoom siv hluav taws xob (piv txwv li, Fe-CU-SN), tsa tus nqi thiab cov khoom siv cov nqi.
Cov xovxwm no tau yooj yim thiab cov neeg pheej yig dua (piv txwv li, Fe-Zn), txo cov nyiaj tau los)
4. Daim Ntawv Thov Kev Sau Npe
Cov cuab yeej kub nias:
Nyiam rauHigh-precision, cov haujlwm hnyavXws li cov pob zeb txiav, roj drilling, thiab aerospace tivthaiv machining45.
Piv txwv: PCD (polycrystalline pob zeb diamond) tho cov khoom, pob zeb diamond-coated txiav cov ntsiab lus.
Cov Cuab Yeej Txias:
Haum rauCov ntawv thov tsawg, Xws li DIY cuab yeej, thiab cov pob zeb ua kom zoo nkauj ua kom zoo nkauj, thiab cov log uas muaj log tsis sib xws.
Piv txwv: pob zeb diamond sib tsoo, polishing cov cim nyiaj polishia14.
5. Txwv thiab kev lag luam tawm
Kub Pressing:
Kev pheej hmoo ntawmPob zeb diamond GraphitizationLos yog binder oxidation ntawm ntau dhau los kub57.
Grain kev loj hlob hauv cov hlau thaiv hlau tej zaum yuav ua rau cov khoom siv tsis muaj zog27.
COG PRINDING:
Txwv rauYooj yim geometries yooj yimVim tias tsis muaj daim ntawv formability14.
Cov pob zeb dua qis rau cov nqi (tsawg dua los yog sib npaug rau 60% vs. ntau dua lossis sib npaug nrog 85% hauv kub nias) 18.
Tag
Qhov kev xaiv ntawm kub thiab txias nias hinges rauKev Ua Tau Zoo Yuav Tsum Tau, Kev Siv Nyiaj Txiag, ThiabNtau lawm nplaiCov. Cov kub nias Dominates tus hwm hwm tau xav tau depability thiab precision25, thaum txias nias cative cus-rhiab, muaj kev sib tw siab, muaj cov khoom lag luam ntau14. Kev nce qib nyob rau hauv binder alloys (piv txwv li, nanostructured fe-ni-cr) thiab hybrid cov kev nias (piv txwv li cov kev daws teeb meem sov, muab cov kev daws teeb meem sov rau kev hloov kho tau27.
